JPH0465558B2 - - Google Patents

Info

Publication number
JPH0465558B2
JPH0465558B2 JP62143034A JP14303487A JPH0465558B2 JP H0465558 B2 JPH0465558 B2 JP H0465558B2 JP 62143034 A JP62143034 A JP 62143034A JP 14303487 A JP14303487 A JP 14303487A JP H0465558 B2 JPH0465558 B2 JP H0465558B2
Authority
JP
Japan
Prior art keywords
layer
photoresist
copper
chromium
plating layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP62143034A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62293689A (ja
Inventor
Baajesute Hamitsudo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Co
Original Assignee
Minnesota Mining and Manufacturing Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Minnesota Mining and Manufacturing Co filed Critical Minnesota Mining and Manufacturing Co
Publication of JPS62293689A publication Critical patent/JPS62293689A/ja
Publication of JPH0465558B2 publication Critical patent/JPH0465558B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/38—Improvement of the adhesion between the insulating substrate and the metal
    • H05K3/388—Improvement of the adhesion between the insulating substrate and the metal by the use of a metallic or inorganic thin film adhesion layer
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0154—Polyimide
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Manufacturing Of Printed Wiring (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Laminated Bodies (AREA)
  • Non-Silver Salt Photosensitive Materials And Non-Silver Salt Photography (AREA)
JP62143034A 1986-06-09 1987-06-08 改良した回路材料の製造方法 Granted JPS62293689A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US87184386A 1986-06-09 1986-06-09
US871843 1986-06-09

Publications (2)

Publication Number Publication Date
JPS62293689A JPS62293689A (ja) 1987-12-21
JPH0465558B2 true JPH0465558B2 (en]) 1992-10-20

Family

ID=25358267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP62143034A Granted JPS62293689A (ja) 1986-06-09 1987-06-08 改良した回路材料の製造方法

Country Status (5)

Country Link
EP (1) EP0257737A3 (en])
JP (1) JPS62293689A (en])
KR (1) KR960001355B1 (en])
CA (1) CA1263763A (en])
MY (1) MY101308A (en])

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CA1286586C (en) * 1987-03-26 1991-07-23 Shigeki Yokoyama Finish laminates for high frequency circuits
DE3907004A1 (de) * 1989-03-04 1990-09-06 Contraves Ag Verfahren zum herstellen von duennschichtschaltungen
JP2795702B2 (ja) * 1989-10-26 1998-09-10 イビデン株式会社 高密度配線板の製造方法
JPH05129760A (ja) * 1991-11-06 1993-05-25 Fujitsu Ltd 導体パターンの形成方法
JPH08330728A (ja) * 1995-05-26 1996-12-13 Toyo Metaraijingu Kk フレキシブルプリント配線用基板
MY139405A (en) * 1998-09-28 2009-09-30 Ibiden Co Ltd Printed circuit board and method for its production
CA2327801A1 (en) * 2000-03-21 2001-09-21 Rocky L. Hilburn Copper on polymer component having improved adhesion
WO2002003767A1 (en) * 2000-06-29 2002-01-10 3M Innovative Properties Company Multi-metal layer circuit
KR100912920B1 (ko) 2001-09-05 2009-08-20 니폰 제온 가부시키가이샤 다층 회로 기판, 수지 기재 및 그의 제조 방법
KR100464559B1 (ko) * 2002-03-22 2005-01-03 정남교 벨크로 테이프 제조장치
JP4298597B2 (ja) 2004-07-01 2009-07-22 日東電工株式会社 配線回路基板および配線回路基板の製造方法
SG126776A1 (en) * 2005-04-08 2006-11-29 3M Innovative Properties Co Flexible circuit substrate
US9953908B2 (en) 2015-10-30 2018-04-24 International Business Machines Corporation Method for forming solder bumps using sacrificial layer
JP2021056162A (ja) * 2019-10-01 2021-04-08 日東電工株式会社 導電フィルムおよび温度センサフィルム
CN110676156A (zh) * 2019-10-21 2020-01-10 昆山百利合电子材料有限公司 一种光刻半导体加工工艺

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3832176A (en) * 1973-04-06 1974-08-27 Eastman Kodak Co Novel photoresist article and process for its use
US3981691A (en) * 1974-07-01 1976-09-21 Minnesota Mining And Manufacturing Company Metal-clad dielectric sheeting having an improved bond between the metal and dielectric layers

Also Published As

Publication number Publication date
EP0257737A2 (en) 1988-03-02
KR880001182A (ko) 1988-03-31
JPS62293689A (ja) 1987-12-21
CA1263763A (en) 1989-12-05
MY101308A (en) 1991-09-05
EP0257737A3 (en) 1989-07-19
KR960001355B1 (ko) 1996-01-26

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